Semiconductors & CHIPS Act
Federal funding for semiconductor manufacturing, materials, and supply-chain resilience.
We help fabs, equipment, materials, and packaging companies pursue CHIPS Act and related NIST / DoD semiconductor pathways with lender- and agency-ready packaging.
Who this is for
Semiconductor manufacturers, equipment and materials suppliers, packaging houses, and consortia pursuing CHIPS and related domestic industrial-base funding.
What we do
- CHIPS / NIST pathway fit and readiness assessment
- Application strategy, technical narrative, and financial package coordination
- Supply-chain, workforce, and national-security positioning for reviewers
Focus areas
- CHIPS manufacturing incentives: Facility build, expand, and modernize projects for leading-edge, current, and mature-node production.
- Supply chain and materials: Equipment, materials, and packaging projects that strengthen the domestic semiconductor ecosystem.
- Defense microelectronics: DARPA MTO and DoD pathways for trusted, advanced microsystems and packaging.
Programs
- CHIPS Act Funding: Pursue CHIPS Act and related semiconductor manufacturing, materials, and supply-chain funding with NIST- and DoD-ready packaging.
- DARPA MTO Funding: Support DARPA Microsystems Technology Office pursuits with office-fit strategy and submission-ready technical packaging.
- DARPA BAA Strategy: Develop DARPA BAA response strategies with compliant proposal structure, technical differentiation, and office-specific positioning.
Agencies
NIST / CHIPS, DoD microelectronics, DARPA MTO